JPH0227522Y2 - - Google Patents

Info

Publication number
JPH0227522Y2
JPH0227522Y2 JP1983008357U JP835783U JPH0227522Y2 JP H0227522 Y2 JPH0227522 Y2 JP H0227522Y2 JP 1983008357 U JP1983008357 U JP 1983008357U JP 835783 U JP835783 U JP 835783U JP H0227522 Y2 JPH0227522 Y2 JP H0227522Y2
Authority
JP
Japan
Prior art keywords
lead
chip
parts
chip component
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983008357U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59115604U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP835783U priority Critical patent/JPS59115604U/ja
Publication of JPS59115604U publication Critical patent/JPS59115604U/ja
Application granted granted Critical
Publication of JPH0227522Y2 publication Critical patent/JPH0227522Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thermistors And Varistors (AREA)
JP835783U 1983-01-26 1983-01-26 電子部品のリ−ドフレ−ム Granted JPS59115604U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP835783U JPS59115604U (ja) 1983-01-26 1983-01-26 電子部品のリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP835783U JPS59115604U (ja) 1983-01-26 1983-01-26 電子部品のリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS59115604U JPS59115604U (ja) 1984-08-04
JPH0227522Y2 true JPH0227522Y2 (en]) 1990-07-25

Family

ID=30139847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP835783U Granted JPS59115604U (ja) 1983-01-26 1983-01-26 電子部品のリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS59115604U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326113A (ja) * 2000-05-15 2001-11-22 Oizumi Seisakusho:Kk 電子部品実装用リードフレームおよび電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574028U (en]) * 1978-11-15 1980-05-21
JPS5744531U (en]) * 1980-08-26 1982-03-11
JPS5948027U (ja) * 1982-09-21 1984-03-30 日通工株式会社 コンデンサのリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS59115604U (ja) 1984-08-04

Similar Documents

Publication Publication Date Title
US4214120A (en) Electronic device package having solder leads and methods of assembling the package
JPH0151064B2 (en])
JPH0227522Y2 (en])
US5090926A (en) Solderable lead
US4785990A (en) Electronic component with lead terminals and method of manufacturing said electronic component
JPH0310714Y2 (en])
US5107324A (en) Two-terminal semiconductor device of surface installation type
JPH0356031Y2 (en])
JPH0517869Y2 (en])
US7093357B2 (en) Method for manufacturing an electronic component
JPS6311697Y2 (en])
JPS60109295A (ja) 実装基板およびそれを用いた実装体
JPH0319241Y2 (en])
JPH0411984Y2 (en])
JPH0533807B2 (en])
JPH081564Y2 (ja) セラミック基板回路のリード線構造
JPH0356032Y2 (en])
JPH0670934B2 (ja) リード端子フレーム
JPS61287118A (ja) 電子部品の製造方法
JPH05275216A (ja) Ｓｉｐ形面実装ネットワーク抵抗器の製造方法
JPS62566B2 (en])
JPS60106121A (ja) 電子部品の製造方法
JPS6230307A (ja) リード端子付き電子部品の製造方法
JPH063201A (ja) サーミスタセンサの製造方法およびそのサーミスタセンサ
JPS63192296A (ja) リ−ド線取付方法